A and M Electronics, Inc. provides contract manufacturing of single-sided and multilayered class III circuit board assemblies using SMT, BGA, micro BGA, and through hole manufacturing methods. Boards can be manufactured from fiberglass or standardized FR-4 epoxy laminate in sizes up to 14″ x 16″. Our automated SMT machine can build assemblies with a repeatability of .025 mm at a rate of 13,500 cph. We are also capable of hand soldering and applying conformal coating to assemblies that will be used in harsh environments. All of our operators are IPC-A-610 certified, most of which have been with us for over 20 years. Our automated optical inspection (AIO) system checks assemblies for conformance, while our in-line de-ionized aqueous cleaning system removes flux from the boards and ensure all assemblies are clean and dry.
Our customers require the highest degree of quality and reliability. To that end, we have achieved and maintained a number of industry specific certifications including IPC/ANSI J-STD-001, AS9100, ITAR registration, RoHs compliance, NADCAP, ISO 9001:2015 and AS9100D certifications. We also meet all applicable Mil-Spec standards. Burn-in testing, engineering and design, first articles, and packaging services are also available. For more information about our contract manufacturing of circuit board assemblies, see the table below, or contact us directly.